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NFPA 318, Standard for the Protection of Semiconductor Fabrication Facilities

2022 NFPA 318 Standard - Current Edition
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  • Description

    Improve chemical safety and emergency response using the 2022 edition of NFPA 318, Standard for the Protection of Semiconductor Fabrication Facilities.

    The semiconductor industry continues to advance and new safeguards are required to address the ever-evolving hazards. NFPA 318, Standard for the Protection of Semiconductor Fabrication Facilities, applies to semiconductor fabrication facilities and comparable fabrication processes, including research and development (R&D) areas in which hazardous chemicals are used, stored, and handled and areas containing a cleanroom or clean zone.

    The chapters in this standard address every aspect of safety, from general precautions and fire protection to construction, chemical storage and handling, hazardous gas cylinder storage and distribution, bulk silane systems, production and support equipment, emergency control stations, and means of egress.

    The 2022 edition of NFPA 318, Standard for the Protection of Semiconductor Fabrication Facilities, can help all stakeholders involved in fire protection, including engineers, authorities having jurisdiction (AHJs), facility personnel, and contractors.

    Several revisions were made for the 2022 edition of the standard. Those changes include the following:

    • Tables for hazardous material quantity limits have been updated to clarify aggregate limits and allowable increases, as well as to reflect quantities utilized in fabrication facilities.
    • A new requirement has been added for cabinets storing pyrophoric liquids to be protected by a fire control system.
    • New annex material has been added listing the fire control performance requirements for pyrophoric liquid fires.
    • New language has been added allowing bulk gas purge sources to be used in place of purge cylinders if specific criteria are met.
    • High-sensitivity smoke detection has been added as an option for silane delivery systems.

    Get the latest requirements for semiconductor fabrication facilities by ordering your copy of the 2022 edition of NFPA 318, Standard for the Protection of Semiconductor Fabrication Facilities, today. (Print, 44 pp., 2022)

  • Table of Contents (2022 Current Edition)

    NFPA® 318 Standard for the Protection of Semiconductor Fabrication Facilities, 2022 Edition

    Chapter 1 Administration
    1.1 Scope.
    1.2 Purpose.
    1.3 Retroactivity.
    1.4 Equivalency.
    1.5 Units.
    Chapter 2 Referenced Publications
    2.1 General.
    2.2 NFPA Publications.
    2.3 Other Publications.
    2.4 References for Extracts in Mandatory Sections.
    Chapter 3 Definitions
    3.1 General.
    3.2 NFPA Official Definitions.
    3.3 General Definitions.
    Chapter 4 Building Construction and Related Services
    4.1 General.
    4.2 Classification of Occupancy.
    4.3 Noncombustible Construction Components.
    4.4 Fire Resistance Rating.
    4.5 Pass-Throughs in Existing Exit Access Corridors.
    4.6 Vertical Openings.
    4.7 Air Supply and Recirculation Systems.
    4.8 Electrical Classification.
    4.9 Emergency Power System.
    4.10 Means of Egress.
    Chapter 5 Hazardous Materials — General Provisions
    5.1 Hazardous Chemicals.
    5.2 HPM Risk Assessment.
    5.3 Container Delivery.
    5.4 Storage and Handling of Hazardous Chemicals.
    5.5 Separation of Hazardous Chemicals.
    5.6 Systems, Equipment, and Processes.
    5.7 Supply Piping.
    5.8 Welding.
    Chapter 6 Liquid Chemical Storage and Handling
    6.1 General.
    6.2 Flammable and Combustible Liquid Delivery Systems.
    6.3 Spill Protection.
    6.4 Pyrophoric Liquids.
    6.5 Corrosive Liquids.
    6.6 Toxic and Highly Toxic Materials.
    6.7 Water Reactive Chemistries.
    6.8 Oxidizers.
    Chapter 7 Gas Storage and Handling
    7.1 General.
    7.2 Corrosive Gases.
    7.3 Flammable Gases.
    7.4 Oxidizing Gases.
    7.5 Pyrophoric Gases.
    7.6 Silane Systems.
    7.7 Toxic and Highly Toxic Gases.
    7.8 Unstable Reactive Gases.
    7.9 Cryogenic Fluids.
    7.10 Bulk Oxygen Systems.
    7.11 Gaseous Hydrogen Systems.
    7.12 Liquefied Hydrogen Systems.
    7.13 Gas Generation Systems.
    7.14 Dopant Gas Sources.
    Chapter 8 Production and Support Equipment
    8.1 General.
    8.2 Materials of Construction.
    8.3 Equipment Safety Systems and Interlocks.
    8.4 Electrical Design.
    8.5 Process Liquid Heating Equipment.
    8.6 General Requirements for Tools Using Flammable or Combustible Liquids.
    8.7 Photolithography Tools.
    8.8 Ion Implanters.
    8.9 Wet Process and Wet Etch Tools.
    8.10 CVD and Furnace Tools.
    8.11 Automated Materials Handling Systems (AMHS).
    8.12 Support Equipment.
    8.13 Production Equipment Fire Protection.
    8.14 Exposures.
    Chapter 9 Exhaust Systems
    9.1 General Exhaust Conditions.
    9.2 Local Hazardous Chemical Exhaust System.
    9.3 Local Hazardous Chemical Exhaust System Construction.
    9.4 Hazardous Chemical Exhaust Duct Airflow and Dilution.
    9.5 Exhaust Ducts.
    9.6 Hazardous Chemical Exhaust Controls.
    Chapter 10 Waste Treatment
    10.1 Waste Recovery and Handling Systems.
    10.2 Acid Waste Treatment Facility Safeguards.
    10.3 Organic Waste Treatment Facilities.
    10.4 Waste Liquid Handling.
    10.5 Effluent Treatment Systems.
    10.6 Scrubbers.
    10.7 Vapor Recovery and Vapor Processing Systems.
    Chapter 11 Fire Protection
    11.1 Facility-Wide Systems.
    11.2 Protection of Specific Facility Elements.
    Chapter 12 General Safety Precautions
    12.1 Emergency Plan.
    12.2 Emergency Response Team.
    12.3 Emergency Drills.
    Annex A Explanatory Material
    Annex B Seismic Protection
    Annex C Production and Support Equipment
    Annex D Informational References
  • Prior Editions

    2018 Edition

     

    Improve chemical safety and emergency response using the 2018 edition of NFPA 318, Standard for the Protection of Semiconductor Fabrication Facilities.

    The semiconductor industry continues to advance, requiring new safeguards to address evolving hazards. Reorganized and with major revisions to the requirements for both gas-detection systems as well as smoke detection systems, NFPA 318, Standard for the Protection of Semiconductor Fabrication Facilities applies to semiconductor fabrication facilities and comparable R&D areas in which hazardous chemicals are used, stored, and handled -- containing a cleanroom or clean zone or both.

    Chapters address every aspect of safety, from general safety precautions and fire protection to construction, chemical storage and handling, hazardous gas cylinder storage and distribution, bulk silane systems, production and support equipment, emergency control station, and means of egress.

    The 2018 edition of NFPA 318 assists all stakeholders involved in fire protection: engineers, AHJs, facility personnel, and contractors.

    • Requirements for gas-detection systems as well as smoke detection systems are technically modified and also revised for clarity.
    • Gas detection criteria are revised to clarify when detection is needed and where it is required to be physically provided.
    • Requirements for detection are revised to include not just minimum capabilities of detectors but also coverage areas, alert and alarm sensitivities, and maximum transport times taken from NFPA 76, Standard for the Fire Protection of Telecommunications Facilities, which were based on research conducted by the Fire Protection Research Foundation.

    Get the latest requirements for semiconductor fabrication facilities in the 2018 edition of NFPA 318. (Print, 44 pp., 2018)

    2015 Edition

     

    Chemical safety and emergency response demand the 2015 NFPA 318, Standard for the Protection of Semiconductor Fabrication Facilities.

    The semiconductor industry is continually growing, requiring new safeguards to address evolving hazards. Completely reorganized and up-to-date with the latest coverage of technologies such as photovoltaics, NFPA 318, Standard for the Protection of Semiconductor Fabrication Facilities applies to semiconductor fabrication facilities and comparable R&D areas in which hazardous chemicals are used, stored, and handled -- containing a cleanroom or clean zone or both.

    Chapters address every aspect of safety, from general safety precautions and fire protection to construction, chemical storage and handling, hazardous gas cylinder storage and distribution, bulk silane systems, production and support equipment, emergency control station, and means of egress. This edition adds display panel and photovoltaic production to its scope, along with other major changes.

    The 2015 NFPA 318 assists all stakeholders involved in fire protection: engineers, AHJs, facility personnel, and contractors.

    This rewritten, clarified edition provides new definitions, identification of hazardous materials categories, and an introduction to Hazard Production Material (HPM) risk assessment. It also adds numerous new requirements addressing:

    • Hazardous materials
    • Liquid chemical storage and handling
    • Gas storage and handling
    • Production and support equipment
    • Waste treatment
    • Fire protection

    Get the latest requirements for semiconductor fabrication facilities, in the most user-friendly format, in the 2015 NFPA 318. (Softbound, 44 pp., 2015)

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